Bassel Ayoub

According to our database, Bassel Ayoub authored at least 2 papers between 2022 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.

Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects.

Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Hélène Frémont

Proceedings of the IEEE International Reliability Physics Symposium, 2022