B. K. Lok

According to our database, B. K. Lok authored at least 2 papers in 2008.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2008

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.

C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun

Microelectron. Reliab., 2008

High Aspect Pattern Formation by Integration of Micro Inkjetting and Electroless Plating

P. W. Gian, Xuechuan Shan, Y. N. Liang, B. K. Lok, C. W. Lu, Ban-Leong Ooi

CoRR, 2008