Avram Bar-Cohen
According to our database1,
Avram Bar-Cohen
authored at least 6 papers
between 1985 and 2016.
Collaborative distances:
Collaborative distances:
Awards
IEEE Fellow
IEEE Fellow 1993, "For contributions to the understanding of thermal phenomena in electronic packaging.".
Timeline
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2016
IEEE Trans. Very Large Scale Integr. Syst., 2016
2013
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit.
IET Circuits Devices Syst., 2013
2012
Microelectron. Reliab., 2012
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2012
2006
Proc. IEEE, 2006
1985
Bounding relations for natural convection heat transfer from vertical printed circuit boards.
Proc. IEEE, 1985