Avram Bar-Cohen

According to our database1, Avram Bar-Cohen authored at least 6 papers between 1985 and 2016.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 1993, "For contributions to the understanding of thermal phenomena in electronic packaging.".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2016
Unlocking the True Potential of 3-D CPUs With Microfluidic Cooling.
IEEE Trans. Very Large Scale Integr. Syst., 2016

2013
Co-design of micro-fluidic heat sink and thermal through-silicon-vias for cooling of three-dimensional integrated circuit.
IET Circuits Devices Syst., 2013

2012
Life prediction of LED-based recess downlight cooled by synthetic jet.
Microelectron. Reliab., 2012

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2012

2006
Direct Liquid Cooling of High Flux Micro and Nano Electronic Components.
Proc. IEEE, 2006

1985
Bounding relations for natural convection heat transfer from vertical printed circuit boards.
Proc. IEEE, 1985


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