A Time-Division Multiplexing Multi-Channel Micro-Electrochemical Workstation with Carbon-Based Material Electrodes for Online L-Trosine Detection.

High-Precision Resistivity Measurement of Silicon Wafer Under Unstable Lift-Off Distance Using Inductive and Laser Sensors-Integrated Probe.

High-Sensitivity Signal Processing Circuit Integrated Coil Antenna Sensor Toward Measurements of the Water Fraction in the Oil-Water Two-Phase Flow.

High-Precision Thickness Measurement of Cu Film on Si-Based Wafer Using Erasable Printed Eddy Current Coil and High-Sensitivity Associated Circuit Techniques.

Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer on Wafer for CMP Application.

Analysis and Design of Coil-Based Electromagnetic-Induced Thermoacoustic for Rail Internal-Flaw Inspection.

Noncontact Thickness Measurement of Cu Film on Silicon Wafer Using Magnetic Resonance Coupling for Stress Free Polishing Application.