Optical Measurement for the Alarming Height of Silver Paste Overflow Surrounding APD Chip in Optical Component Packaging.
IEEE Trans. Instrum. Meas., 2025
A Strategy for Real-Time Suppressing the Fluctuation of DFB Chip Microcharacter Spotting Accuracy in Optical Device Packaging.
IEEE Trans. Instrum. Meas., 2024
A Non-Invasive Pre-Bonding Screening Method for Cascaded SOA-Based Photonic Integrated Circuits.
Proceedings of the International Conference on Photonics in Switching and Computing, 2023