Numerical simulation of copper electrodeposition for Through Silicon Via (TSV) with SPS-PEG-Cl additive system.
Microelectron. J., February, 2024
Study on Complementary Auxiliary Cathode Method for Improving the Microstructure Uniformity of Electroplated Thick Metal Film.
Proceedings of the 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2023