A two-layer approach for solving robust decentralized multiproject scheduling problem with multi-skilled staff.
Int. Trans. Oper. Res., May, 2024
Recent Ground Displacement Over Permafrost in Midwestern Spitsbergen, Svalbard: InSAR Measurements and Modeling.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens., 2024
Collaborative Heave Compensation Control of Dual Ship-mounted Lifting Arm System Based on Incremental Model Predictive Control.
Proceedings of the 14th Asian Control Conference, 2024
Soft Actor-Critic Based Controller for Offshore Lifting Arm System of Active 3-DOF Wave Compensation Using Gym Environment with PyBullet.
Proceedings of the 14th Asian Control Conference, 2024
A Two-Stage Algorithm Based on 12 Priority Rules for the Stochastic Distributed Resource-Constrained Multi-Project Scheduling Problem With Multi-Skilled Staff.
IEEE Access, 2023
Intercomparison of Arctic Sea Ice Backscatter and Ice Type Classification Using Ku-Band and C-Band Scatterometers.
IEEE Trans. Geosci. Remote. Sens., 2022
A two-stage approach with softmax scoring mechanism for a multi-project scheduling problem sharing multi-skilled staff.
Expert Syst. Appl., 2022
Influence of Melt Ponds on the SSMIS-Based Summer Sea Ice Concentrations in the Arctic.
Remote. Sens., 2021
Evaluation of 2-m Air Temperature and Surface Temperature from ERA5 and ERA-I Using Buoy Observations in the Arctic during 2010-2020.
Remote. Sens., 2021
The Role of Mobile Payment in Increasing Consumers' Preferences towards Hedonic Products.
Proceedings of the 25th Pacific Asia Conference on Information Systems, 2021
The Effect of AI-based Recommendations on Healthy Diet Promotion.
Proceedings of the 25th Pacific Asia Conference on Information Systems, 2021
Arctic Sea Ice Classification Using Microwave Scatterometer and Radiometer Data During 2002-2017.
IEEE Trans. Geosci. Remote. Sens., 2019
Automatically Extracted Antarctic Coastline Using Remotely-Sensed Data: An Update.
Remote. Sens., 2019
Degradation in P-type Poly-Si Thin-Film Transistors under Pulse Bias Stresses.
Proceedings of the International Conference on IC Design and Technology, 2019