7.6 A 2.06pJ/b 106.25Gb/s PAM-4 Receiver with 3-Tap FFE and 1-Tap Speculative DFE in 28nm CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025
7.7 A 2.16pJ/b 112Gb/s PAM-4 Transceiver with Time-Interleaved 2b/3b ADCs and Unbalanced Baud-Rate CDR for XSR Applications in 28nm CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
ICE: An Intelligent Cognition Engine with 3D NAND-based In-Memory Computing for Vector Similarity Search Acceleration.
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Proceedings of the 55th IEEE/ACM International Symposium on Microarchitecture, 2022
A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Similar-Vector-Matching Operations on Edge-AI Devices.
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Proceedings of the IEEE International Solid-State Circuits Conference, 2022
Attention EdgeConv For 3D Point Cloud Classification.
Proceedings of the Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2021
3D-GFE: a Three-Dimensional Geometric-Feature Extractor for Point Cloud Data.
Proceedings of the Asia-Pacific Signal and Information Processing Association Annual Summit and Conference, 2021
Thermal sensor allocation and full-system temperature characterization for thermal-aware mesh-based NoC system by using compressive sensing technique.
Proceedings of the 2017 International Symposium on VLSI Design, Automation and Test, 2017
Correlation-graph-based temperature sensor allocation for thermal-aware network-on-chip systems.
Proceedings of the 2016 IEEE Asia Pacific Conference on Circuits and Systems, 2016