Virtual Metrology for Semiconductor Chemical Mechanical Planarization Process Using Wide & Deep Learning.
Proceedings of the ICCPR '21: 10th International Conference on Computing and Pattern Recognition, Shanghai, China, October 15, 2021
Phase Partition Based Virtual Metrology for Material Removal Rate Prediction in Chemical Mechanical Planarization Process.
Proceedings of the Artificial Intelligence - First CAAI International Conference, 2021