4 x 200 Gb/s EML-Array with a Single MQW Layer Stack.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023
56 GBaud PAM-4 Direct Detection with High-Speed Avalanche Photodiodes.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023
Uncooled 100 GBd O-Band EML for Datacom Transmitter Arrays.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022
InP/Silicon Hybrid External-Cavity Lasers (ECL) using Photonic Wirebonds as Coupling Elements.
,
,
,
,
,
,
,
,
,
,
,
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020
4 × 56 Gb/s high output power electroabsorption modulated laser array.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2017
Ultra-low power SiGe driver-IC for high-speed electroabsorption modulated DFB lasers.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2017
8-Channel 448 Gbit/s silicon photonic transmitter enabled by photonic wire bonding.
,
,
,
,
,
,
,
,
,
,
,
,
,
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2017
Four-Channel 784 Gbit/s Transmitter Module Enabled by Photonic Wire Bonding and Silicon-Organic Hybrid Modulators.
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
Proceedings of the European Conference on Optical Communication, 2017
2 × 56 GB/s from a double side electroabsorption modulated DFB laser.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016
Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips.
,
,
,
,
,
,
,
,
,
,
,
,
,
,
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016
Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser.
Microelectron. Reliab., 2006