(Why do we need) Wireless Heterogeneous Integration (anyway?).
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Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
Die to wafer 3D stacking for below 10um pitch microbumps.
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Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier.
Proceedings of the 28th International Conference of the IEEE Engineering in Medicine and Biology Society, 2006
Analysis and modeling of power grid transmission lines.
Proceedings of the Conference on Design, Automation and Test in Europe, 2006
Package level interconnect options.
Proceedings of the Seventh International Workshop on System-Level Interconnect Prediction (SLIP 2005), 2005