SenseBack - An Implantable System for Bidirectional Neural Interfacing.
IEEE Trans. Biomed. Circuits Syst., 2020
Neuro-PULP: A Paradigm Shift Towards Fully Programmable Platforms for Neural Interfaces.
Proceedings of the 2nd IEEE International Conference on Artificial Intelligence Circuits and Systems, 2020
SenseBack - Implant considerations for an implantable neural stimulation and recording device.
Proceedings of the 2019 IEEE Biomedical Circuits and Systems Conference, 2019
Embedded Phase-Amplitude Coupling Based Closed-loop Platform for Parkinson's Disease.
Proceedings of the 2018 IEEE Biomedical Circuits and Systems Conference, 2018
A 64-Channel Versatile Neural Recording SoC With Activity-Dependent Data Throughput.
IEEE Trans. Biomed. Circuits Syst., 2017
A 32-ch. bidirectional neural/EMG interface with on-chip spike detection for sensorimotor feedback.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2016
An event-driven SoC for neural recording.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2016
Live demonstration: A scalable 32-channel neural recording and real-time FPGA based spike sorting system.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2015
An Infrastructure Supporting Considerate Sensor Service Provisioning.
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Proceedings of the 2013 IEEE 6th International Conference on Service-Oriented Computing and Applications, 2013
A 890fJ/bit UWB transmitter for SOC integration in high bit-rate transcutaneous bio-implants.
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013
Towards a fully-integrated solution for capacitor-based neural stimulation.
Proceedings of the 2012 IEEE International Symposium on Circuits and Systems, 2012
A novel charge-metering method for voltage mode neural stimulation.
Proceedings of the 2012 IEEE International Symposium on Circuits and Systems, 2012
A fully-programmable neural interface for multi-polar, multi-channel stimulation strategies.
Proceedings of the 2012 IEEE International Symposium on Circuits and Systems, 2012
Towards an inductively coupled power/data link for bondpad-less silicon chips.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2011), 2011