System technology co-optimization and design challenges for 3D IC.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2022
Applying IEEE Std 1838 to the 3DIC Design Trishul - A Case Study.
Proceedings of the 26th IEEE European Test Symposium, 2021
3D-Split SRAM: Enabling Generational Gains in Advanced CMOS.
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Proceedings of the IEEE Custom Integrated Circuits Conference, 2021
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology.
CoRR, 2020