A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021
Fast Electrostatic Analysis For VLSI Aging based on Generative Learning.
Proceedings of the 3rd ACM/IEEE Workshop on Machine Learning for CAD, 2021
Runtime Long-Term Reliability Management Using Stochastic Computing in Deep Neural Networks.
Proceedings of the 22nd International Symposium on Quality Electronic Design, 2021
Data-Driven Electrostatics Analysis based on Physics-Constrained Deep learning.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2021
EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks.
Proceedings of the 58th ACM/IEEE Design Automation Conference, 2021
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires.
IEEE Trans. Very Large Scale Integr. Syst., 2020
Full-chip wire-oriented back-end-of-line TDDB hotspot detection and lifetime analysis.
Integr., 2020
GLU3.0: Fast GPU-based Parallel Sparse LU Factorization for Circuit Simulation.
IEEE Des. Test, 2020
Run-Time Accuracy Reconfigurable Stochastic Computing for Dynamic Reliability and Power Management.
CoRR, 2020
Data-Driven Fast Electrostatics and TDDB Aging Analysis.
Proceedings of the MLCAD '20: 2020 ACM/IEEE Workshop on Machine Learning for CAD, 2020
Run-Time Accuracy Reconfigurable Stochastic Computing for Dynamic Reliability and Power Management: Work-in-Progress.
Proceedings of the International Conference on Compilers, 2020
Long-Term Reliability Management For Multitasking GPGPUs.
Proceedings of the 16th International Conference on Synthesis, 2019
Multi-Thread Assembling for Fast FEM Power Delivery DC Integrity Analysis.
Proceedings of the 13th IEEE International Conference on ASIC, 2019
Physics-Based Compact TDDB Models for Low-k BEOL Copper Interconnects With Time-Varying Voltage Stressing.
IEEE Trans. Very Large Scale Integr. Syst., 2018