Advanced novel optical stack technologies for high SNR in CMOS Image Sensor.
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Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
A 1280×960 Dynamic Vision Sensor with a 4.95-μm Pixel Pitch and Motion Artifact Minimization.
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Proceedings of the IEEE International Symposium on Circuits and Systems, 2020
Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications.
Microelectron. Reliab., 2017
Multi-function unit for LED lighting.
Proceedings of the International SoC Design Conference, 2012
Advanced TSV filling method with Sn alloy and its reliability.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Fabrication and bonding process of fine pitch Cu pillar bump on thin Si chip for 3D stacking IC.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011