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2015
From fan-out wafer to fan-out panel level packaging.
[DOI]
Tanja Braun
,
K.-F. Becker
,
S. Raatz
,
V. Bader
,
Jörg Bauer
,
Rolf Aschenbrenner
,
S. Voges
,
Tina Thomas
,
R. Kahle
,
Klaus-Dieter Lang
Proceedings of the European Conference on Circuit Theory and Design, 2015