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2023
Comprehensive 300 mm process for Silicon spin qubits with modular integration.
[DOI]
A. Elsayed
,
Clement Godfrin
,
Nard I. Dumoulin Stuyck
,
M. M. K. Shehata
,
Stefan Kubicek
,
S. Massar
,
Yann Canvel
,
Julien Jussot
,
Andriy Hikavyy
,
Roger Loo
,
George Simion
,
Massimo Mongillo
,
D. Wan
,
Bogdan Govoreanu
,
Ruoyu Li
,
Iuliana P. Radu
,
Pol Van Dorpe
,
Kristiaan De Greve
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023