Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components.

Diffusion growth of Cu₃Sn phase in the bump and thin film Cu/Sn structures.

Cu pumping in TSVs: Effect of pre-CMP thermal budget.

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.