MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC.
Proceedings of the Design, Automation & Test in Europe Conference, 2025
FaStTherm: Fast and Stable Full-Chip Transient Thermal Predictor Considering Nonlinear Effects.
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024
ATPlace2.5D: Analytical Thermal-Aware Chiplet Placement Framework for Large-Scale 2.5D-IC.
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024
MTL-Designer: An Integrated Flow for Analysis and Synthesis of Microstrip Transmission Line.
Proceedings of the 60th ACM/IEEE Design Automation Conference, 2023
DeePEB: A Neural Partial Differential Equation Solver for Post Exposure Baking Simulation in Lithography.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022