Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias.
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Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
Sequential 3D: Key integration challenges and opportunities for advanced semiconductor scaling.
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Proceedings of the 2018 International Conference on IC Design & Technology, 2018