Design issues and considerations for low-cost 3D TSV IC technology.
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Proceedings of the IEEE International Solid-State Circuits Conference, 2010
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.
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Proceedings of the IEEE Custom Integrated Circuits Conference, 2010
Hardware and a Tool Chain for ADRES.
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Proceedings of the Reconfigurable Computing: Architectures and Applications, 2006