Integration and Characterization of High Thermal Conductivity Materials for Heat Dissipation in Stacked Devices.
,
,
,
,
,
,
,
,
,
,
,
,
,
,
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
High Thermal Conductivity AlN Films for Advanced 3D Chiplets.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024
A study of protocol analysis for packet switched network.
Proceedings of the seventh symposium on Data communications, 1981