Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates.

Effects of different test profiles of temperature cycling tests on the reliability of RFID tags.

Protective coatings of electronics under harsh thermal shock.

Fretting corrosion: Analysis of the failure mechanism for low voltage drives applications.

High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates.

Reliability of adhesive joined thinned chips on flexible substrates under humid conditions.

Effects of Cycling Humidity on the Performance of RFID Tags With ACA Joints.

Accelerated testing for failures of tantalum capacitors.

Development of a matrix test board for capacitor reliability testing.

Corrosion protection of anisotropically conductive adhesive joined flip chips.

Flip chip attachment on flexible LCP substrate using an ACF.

Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates.

Chip on flex attachment with thermoplastic ACF for RFID applications.