2025
16.2 RNGD: A 5nm Tensor-Contraction Processor for Power-Efficient Inference on Large Language Models.
Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2024
Hyperloop Communications: Intra-Tube Channel Capacity and its Enhancement.
Proceedings of the 22nd International Symposium on Modeling and Optimization in Mobile, 2024

2022
Hyperloop Communications: Unveiling Electromagnetic Propagation in the Hyperloop Tube.
IEEE Veh. Technol. Mag., 2022

Frequency-Dependent Bearing Voltage Model for Squirrel-Cage Induction Motors.
IEEE Trans. Ind. Electron., 2022

Adversarial attacks and defenses on AI in medical imaging informatics: A survey.
Expert Syst. Appl., 2022

2021
Stator Impedance Modeling Platform for the Electromagnetic Compatibility Aware Design of 3.7- to 7.5-KW Squirrel-Cage Induction Motors.
IEEE Trans. Ind. Electron., 2021

2020
Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array.
IEEE Access, 2020

2019
Power Integrity Coanalysis Methodology for Multi-Domain High-Speed Memory Systems.
IEEE Access, 2019

2018
Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case study.
Proceedings of the 2018 Design, Automation & Test in Europe Conference & Exhibition, 2018

2017
Review of Near-Field Wireless Power and Communication for Biomedical Applications.
IEEE Access, 2017

2016
Novel Adaptive Power-Gating Strategy and Tapered TSV Structure in Multilayer 3D IC.
ACM Trans. Design Autom. Electr. Syst., 2016

2015
Novel adaptive power gating strategy of TSV-based multi-layer 3D IC.
Proceedings of the Sixteenth International Symposium on Quality Electronic Design, 2015

2009
Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009

2008
Electric field integral equation combined with cylindrical conduction mode basis functions for electrical modeling of three-dimensional interconnects.
Proceedings of the 45th Design Automation Conference, 2008