2024
A 0.296pJ/bit 17.9Tb/s/mm<sup>2</sup> Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024