X-MAPE: Extending 6G-Connected Self-Adaptive Systems with Reflexive Actions.
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Proceedings of the IEEE Conference on Network Function Virtualization and Software Defined Networks, 2023
Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
Architecture and Advanced Electronics Pathways Toward Highly Adaptive Energy- Efficient Computing.
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Proc. IEEE, 2019
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems.
Microelectron. Reliab., 2018
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly.
Microelectron. Reliab., 2018
A Mathematical Model for the External Scheduling of a Cluster Tool Workstation.
Proceedings of the 2018 Winter Simulation Conference, 2018
A Comparison of an CP and MIP Approach for Scheduling jobs in production areas with Time Constraints and uncertainties.
Proceedings of the 2018 Winter Simulation Conference, 2018
A CP Model for a Scheduling Problem with Limited secondary Resources compared to a des Model.
Proceedings of the 2018 Winter Simulation Conference, 2018
Design considerations and constraints in silicon based optical on-board interconnects for short range communications.
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Proceedings of the 2017 19th International Conference on Transparent Optical Networks (ICTON), 2017
Energy-Efficient Transceivers for Ultra-Highspeed Computer Board-to-Board Communication.
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Proceedings of the IEEE International Conference on Ubiquitous Wireless Broadband, 2015
pH measurements of FET-based (bio)chemical sensors using portable measurement system.
Proceedings of the 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2015
Air-stable, high current density, solution-processable, amorphous organic rectifying diodes (ORDs) for low-cost fabrication of flexible passive low frequency RFID tags.
Microelectron. Reliab., 2014
Polytronik und das Internet der Dinge.
Proceedings of the Internet der Dinge, www.internet-der-dinge.de, 2007
Investigations of the influence of dicing techniques on the strength properties of thin silicon.
Microelectron. Reliab., 2007
Polymer Electronics Systems - Polytronics.
Proc. IEEE, 2005
Influence of gate length on ESD-performance for deep submicron CMOS technology.
Microelectron. Reliab., 2001