Opportunity and Challenge of Chiplet-Based HPC and AIoT.
Proceedings of the International Symposium on VLSI Design, Automation and Test, 2021
A 0.27mm<sup>2</sup> 13.5dBm 2.4GHz all-digital polar transmitter using 34%-efficiency Class-D DPA in 40nm CMOS.
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013
A 4-in-1 (WiFi/BT/FM/GPS) connectivity SoC with enhanced co-existence performance in 65nm CMOS.
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
,
Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012
Single-element and phased-array transceiver chipsets for 60-ghz Gb/s communications.
,
,
,
,
,
,
,
,
,
,
,
IEEE Commun. Mag., 2011
A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications.
IEEE J. Solid State Circuits, 2010
A SiGe BiCMOS 16-element phased-array transmitter for 60GHz communications.
Proceedings of the IEEE International Solid-State Circuits Conference, 2010
A 1V 17.9dBm 60GHz power amplifier in standard 65nm CMOS.
Proceedings of the IEEE International Solid-State Circuits Conference, 2010
A World-Band Triple-Mode 802.11a/b/g SOC in 130-nm CMOS.
IEEE J. Solid State Circuits, 2009
Large Signal HBT Model and Integrated Circuit Design Using 300-Ghz Indium Phosphide HBT Technology
PhD thesis, 2005