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2023
A 3D Stackable 1T1C DRAM: Architecture, Process Integration and Circuit Simulation.
[DOI]
Meng Huang
,
Shufang Si
,
Zheng He
,
Ying Zhou
,
Sijia Li
,
Hong Wang
,
Jinying Liu
,
Dongsheng Xie
,
Mengmeng Yang
,
Kang You
,
Chris Choi
,
Yi Tang
,
Xiaojie Li
,
Shibing Qian
,
Xiaodong Yang
,
Long Hou
,
Weiping Bai
,
Zhongming Liu
,
Yanzhe Tang
,
Qiong Wu
,
Yanqin Wang
,
Tao Dou
,
Jake Kim
,
Guilei Wang
,
Jie Baisp
,
Adachi Takao
,
Chao Zhao
,
Abraham Yoo
Proceedings of the IEEE International Memory Workshop, 2023