IP Session on Chiplet: Design, Assembly, and Test.
Proceedings of the 41st IEEE VLSI Test Symposium, 2023
Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
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Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Die to wafer 3D stacking for below 10um pitch microbumps.
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Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics.
IEICE Trans. Electron., 2014
Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon.
Proceedings of the IEEE International Conference on 3D System Integration, 2010