Novel accurate steady-state thermal resistance model for power chips embedded in TTSVs heat dissipation array.

Investigation of heat dissipation structure embedded in substrate of power chip based on grid-type thermal through silicon vias.

Embedded heat dissipation structure composed of TSVs gradually shrinking from bottom to top in stacked power chips.

Advanced motor driving circuit with improved transfer efficiency based on adaptive segmented control.

Linear current module adaptive to wide operating voltage range based on automatic series/parallel conversion.