32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit.
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Proceedings of the International Symposium on Circuits and Systems (ISCAS 2010), May 30, 2010
Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and below.
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Proceedings of the 35th European Solid-State Circuits Conference, 2009