2007
Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips.
[DOI]
K. K. Jinka
,
S. Ganesan
,
A. Dasgupta
,
S. Ling
,
Andrew A. Shapiro
,
D. Schatzel
Microelectron. Reliab., 2007