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2013
Through-silicon-via-based double-side integrated microsystem for neural sensing applications.
[DOI]
Chih-Wei Chang
,
Po-Tsang Huang
,
Lei-Chun Chou
,
Shang-Lin Wu
,
Shih-Wei Lee
,
Ching-Te Chuang
,
Kuan-Neng Chen
,
Jin-Chern Chiou
,
Wei Hwang
,
Yen-Chi Lee
,
Chung-Hsi Wu
,
Kuo-Hua Chen
,
Chi-Tsung Chiu
,
Ho-Ming Tong
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013