Placement of 3D ICs with Thermal and Interlayer Via Considerations.
Proceedings of the 44th Design Automation Conference, 2007
Placement of Thermal Vias in 3-D ICs Using Various Thermal Objectives.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2006
Temperature-Aware Placement for SOCs.
Proc. IEEE, 2006
Electrothermal analysis and optimization techniques for nanoscale integrated circuits.
Proceedings of the 2006 Conference on Asia South Pacific Design Automation: ASP-DAC 2006, 2006
Placement and Routing in 3D Integrated Circuits.
IEEE Des. Test Comput., 2005
Thermal via placement in 3D ICs.
Proceedings of the 2005 International Symposium on Physical Design, 2005
Net weighting to reduce repeater counts during placement.
Proceedings of the 42nd Design Automation Conference, 2005
Efficient Thermal Placement of Standard Cells in 3D ICs using a Force Directed Approach.
Proceedings of the 2003 International Conference on Computer-Aided Design, 2003