2019
Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination.
[DOI]
Lois Jinzhi Liao
,
Xi Zhang
,
Xiaomin Li
,
Younan Hua
,
Chao Fu
,
Weikok Tee
,
Boonhwa Yee
,
Bisheng Wang
,
Songlin Mao
Proceedings of the International Conference on IC Design and Technology, 2019