2024
Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects.
[DOI]
Anshul Gupta
,
Shreya Kundu
,
Stefan Decoster
,
K. Sah
,
G. Delie
,
B. Truijen
,
Davide Tierno
,
Giulio Marti
,
O. Varela Pedreira
,
B. Kenens
,
Y. Hermans
,
C. Adelmann
,
B. de Wachter
,
Ivan Ciofi
,
G. Murdoch
,
A. Cross
,
Seongho Park
,
Zsolt Tokei
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024