Integrated Circuits for Volumetric Ultrasound Imaging With 2-D CMUT Arrays.
IEEE Trans. Biomed. Circuits Syst., 2013
3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology.
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013
Optimized Circuit Failure Prediction for Aging: Practicality and Promise.
Proceedings of the 2008 IEEE International Test Conference, 2008