2018
Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires.
[DOI]
Miku J. Laakso
,
Simon J. Bleiker
,
Jessica Liljeholm
,
Gustaf E. Martensson
,
Mikhail Asiatici
,
Andreas C. Fischer
,
Göran Stemme
,
Thorbjorn Ebefors
,
Frank Niklaus
IEEE Access, 2018