Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors.
IEICE Trans. Commun., 2024
Pneumatic Concave Deformable Device and Finger Deformation-Based Evaluation for Hardness Perception.
Proceedings of the IEEE World Haptics Conference, 2021
A Built-in Test Circuit for Electrical Interconnect Testing of Open Defects in Assembled PCBs.
IEICE Trans. Inf. Syst., 2016
iSVP: an integrated structural variant calling pipeline from high-throughput sequencing data.
BMC Syst. Biol., 2013
Reciprocal Recommendation for Job Matching with Bidirectional Feedback.
Proceedings of the 2013 Second IIAI International Conference on Advanced Applied Informatics, 2013
Post-digestion 18O Exchange/Labeling for Quantitative Shotgun Proteomics of Membrane Proteins.
Proceedings of the Quantitative Methods in Proteomics, 2012
A built-in test circuit for open defects at interconnects between dies in 3D ICs.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
Onboard calibration of the ASTER instrument.
IEEE Trans. Geosci. Remote. Sens., 2005
Design and preflight performance of ASTER instrument protoflight model.
IEEE Trans. Geosci. Remote. Sens., 1998
Synthesis of decadeoxyribonucleotides containing N6-methyladenine, N4- methylcytosine, and 5-methylcytosine: recognition and cleavage by restriction endonucleases (nucleosides and nucleotides part 74).
Nucleic Acids Res., 1987