Atsushi Kurokawa
According to our database1,
Atsushi Kurokawa
authored at least 66 papers
between 2003 and 2023.
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Bibliography
2023
Bayesian neural network based inductance calculations of wireless power transfer systems.
IEICE Electron. Express, 2023
IEICE Electron. Express, 2023
IEICE Electron. Express, 2023
IEICE Electron. Express, 2023
2022
IEICE Electron. Express, 2022
IEICE Electron. Express, 2022
Enhanced laser trimming of thin film resistors dedicated to snubber for high power IGBT modules.
Proceedings of the 65th IEEE International Midwest Symposium on Circuits and Systems, 2022
Deep Neural Network Based Inductance Calculations of Wireless Power Transfer Systems.
Proceedings of the 11th IEEE Global Conference on Consumer Electronics, 2022
Proceedings of the 11th IEEE Global Conference on Consumer Electronics, 2022
2021
IEICE Electron. Express, 2021
Proceedings of the 10th IEEE Global Conference on Consumer Electronics, 2021
2020
IEICE Electron. Express, 2020
A simple yet precise capacitance estimation method for on-chip power delivery network towards EMC analysis.
IEICE Electron. Express, 2020
Testing Through Silicon Vias in Power Distribution Network of 3D-IC with Manufacturing Variability Cancellation.
Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020
2019
Proceedings of the 62nd IEEE International Midwest Symposium on Circuits and Systems, 2019
Proceedings of the IEEE International Symposium on Circuits and Systems, 2019
Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2019
Proceedings of the IEEE 8th Global Conference on Consumer Electronics, 2019
Proceedings of the 25th IEEE International Symposium on Asynchronous Circuits and Systems, 2019
Advantages and Characteristics of a WPT System with a Resonant Wired-2-Coil Repeater.
Proceedings of the IEEE VTS Asia Pacific Wireless Communications Symposium, 2019
Variability Cancellation to Improve Diagnostic Performance of Testing through Silicon Vias in Power Distribution Network of 3D-IC.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2017
Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs.
Proceedings of the 18th International Symposium on Quality Electronic Design, 2017
2015
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2015
IEICE Electron. Express, 2015
Proceedings of the Sixteenth International Symposium on Quality Electronic Design, 2015
Proceedings of the 15th International Symposium on Communications and Information Technologies, 2015
2014
An Effective Model of the Overshooting Effect for Multiple-Input Gates in Nanometer Technologies.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2014
Proceedings of the 2014 IEEE Asia Pacific Conference on Circuits and Systems, 2014
Proceedings of the 2014 IEEE Asia Pacific Conference on Circuits and Systems, 2014
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
2013
An analytical model of the overshooting effect for multiple-input gates in nanometer technologies.
Proceedings of the 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013), 2013
2012
J. Circuits Syst. Comput., 2012
Proceedings of the International Symposium on Communications and Information Technologies, 2012
2011
A Non-Iterative Method for Calculating the Effective Capacitance of CMOS Gates with Interconnect Load Effect.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2011
Proceedings of the International Symposium on Intelligent Signal Processing and Communications Systems, 2011
2010
Modeling the Overshooting Effect for CMOS Inverter Delay Analysis in Nanometer Technologies.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2010
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2010
IEICE Trans. Electron., 2010
2009
Practical Redundant-Via Insertion Method Considering Manufacturing Variability and Reliability.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009
Improvement in Computational Accuracy of Output Transition Time Variation Considering Threshold Voltage Variations.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009
Accurate Method for Calculating the Effective Capacitance with RC Loads Based on the Thevenin Model.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009
2008
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2008
2007
Proceedings of the 12th Conference on Asia South Pacific Design Automation, 2007
2006
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2006
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2006
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2006
Modeling the Influence of Input-to-Output Coupling Capacitance on CMOS Inverter Delay.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2006
A gate delay model focusing on current fluctuation over wide-range of process and environmental variability.
Proceedings of the 2006 International Conference on Computer-Aided Design, 2006
2005
Efficient Large Scale Integration Power/Ground Network Optimization Based on Grid Genetic Algorithm.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005
A Practical Approach for Efficiently Extracting Interconnect Capacitances with Floating Dummy Fills.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005
Efficient Dummy Filling Methods to Reduce Interconnect Capacitance and Number of Dummy Metal Fills.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005
Modeling the Effective Capacitance of Interconnect Loads for Predicting CMOS Gate Slew.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005
A Novel Model for Computing the Effective Capacitance of CMOS Gates with Interconnect Loads.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005
Capacitance and Yield Evaluations Using a 90-nm Process Technology Based on the Dense Power-Ground Interconnect Architecture.
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005
Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005
2004
Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, 2004
Proceedings of the 2004 Conference on Asia South Pacific Design Automation: Electronic Design and Solution Fair 2004, 2004
2003
Approximation Formula Approach for the Efficient Extraction of On-Chip Mutual Inductances.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2003
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2003
Accurate prediction of the impact of on-chip inductance on interconnect delay using electrical and physical parameter-based RSF.
Proceedings of the 2003 Asia and South Pacific Design Automation Conference, 2003
Proceedings of the 2003 Asia and South Pacific Design Automation Conference, 2003