Asit Kumar Gain

According to our database, Asit Kumar Gain authored at least 8 papers between 2009 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2018

Growth nature of in-situ Cu₆Sn₅-phase and their influence on creep and damping characteristics of Sn-Cu material under high-temperature and humidity.

Asit Kumar Gain, Liangchi Zhang

Microelectron. Reliab., 2018

High-temperature and humidity change the microstructure and degrade the material properties of tin‑silver interconnect material.

Asit Kumar Gain, Liangchi Zhang

Microelectron. Reliab., 2018

2014

Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO₂ composite solders.

Asit Kumar Gain, Y. C. Chan

Microelectron. Reliab., 2014

2011

Effect of additions of ZrO₂ nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads.

Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung

Microelectron. Reliab., 2011

Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO₂ composite solder on flexible ball grid array substrates.

Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung

Microelectron. Reliab., 2011

2010

Effect of nano Al₂O₃ additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads.

Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung

Microelectron. Reliab., 2010

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy.

Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain, Y. C. Chan

Microelectron. Reliab., 2010

2009

Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages.

Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung

Microelectron. Reliab., 2009