Asisa Kumar Panigrahi

According to our database, Asisa Kumar Panigrahi authored at least 7 papers between 2015 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

TCAD Simulation of a 10nm n-Channel Vertical Double Gate Silicon On Insulator MOSFET for Digital Applications.

Srinivas Varma, Ch Pratyusha Chowdari, D. Jayanthi, Asisa Kumar Panigrahi, K. Jamal

Proceedings of the 13th International Conference on Computing Communication and Networking Technologies, 2022

2016

Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC.

Suraj Singh, Asisa Kumar Panigrahi, Om Krishan Singh, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration.

Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration.

Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC.

C. Hemanth Kumar, Asisa Kumar Panigrahi, Om Krishan Singh, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC.

Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding.

Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh

Proceedings of the 2015 International 3D Systems Integration Conference, 2015