Arnita Podpod
According to our database1,
Arnita Podpod
authored at least 3 papers
between 2018 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
2018
2019
2020
2021
2022
2023
2024
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Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2024
Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024
2018
Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits.
Proceedings of the IEEE International Test Conference, 2018