Arnita Podpod

According to our database, Arnita Podpod authored at least 3 papers between 2018 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.

Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

Sub-1 dB Loss SiN-to-Polymer Waveguide Coupling: an Enabler for Co-Packaged Optics.

Jef Van Asch, Jeroen Missinne, Junwen He, Pengfei Xu, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Huseyin Sar, Hakim Kobbi, Swetanshu Bipul, Dieter Bode, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout, Geert Van Steenberge

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

2018

Solutions to Multiple Probing Challenges for Test Access to Multi-Die Stacked Integrated Circuits.

Erik Jan Marinissen, Ferenc Fodor, Arnita Podpod, Michele Stucchi, Yu-Rong Jian, Cheng-Wen Wu

Proceedings of the IEEE International Test Conference, 2018