Arnaud Garnier

According to our database, Arnaud Garnier authored at least 9 papers between 2013 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Evaluation of a Portable fMRI Compatible Robotic Wrist Interface.

Ildar Farkhatdinov, Arnaud Garnier, Tomoki Arichi, Hannes Bleuler, Etienne Burdet

Proceedings of the 44th Annual International Conference of the IEEE Engineering in Medicine & Biology Society, 2022

2021

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

IEEE J. Solid State Circuits, 2021

2020

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2016

ITAC: A complete 3D integration test platform.

Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Development and evaluation of a portable MR compatible haptic interface for human motor control.

Ildar Farkhatdinov, Arnaud Garnier, Etienne Burdet

Proceedings of the 2015 IEEE World Haptics Conference, 2015

3D advanced integration technology for heterogeneous systems.

Pascal Vivet, Christian Bernard, Fabien Clermidy, Denis Dutoit, Eric Guthmuller, Ivan Miro Panades, Gaël Pillonnet, Yvain Thonnart, Arnaud Garnier, Didier Lattard, Amandine Jouve, Franck Bana, Thierry Mourier, Séverine Cheramy

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.

Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Contact-based navigation for an autonomous flying robot.

Adrien Briod, Przemyslaw Kornatowski, Adam Klaptocz, Arnaud Garnier, Marco Pagnamenta, Jean-Christophe Zufferey, Dario Floreano

Proceedings of the 2013 IEEE/RSJ International Conference on Intelligent Robots and Systems, 2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013