Armin Klumpp

According to our database, Armin Klumpp authored at least 10 papers between 2008 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

A CMOS-Based Electrochemical DNA Hybridization Microarray for Diagnostic Applications with 109 Test Sites.

Norman Dodel, Roland Thewes, Anouar Laifi, Dirk Eberhardt, Stefan Keil, Leonhard Sturm, Armin Klumpp, Oliver Freudenberg, Friedel Gerfers, Gerhard Hartwich

Proceedings of the 2019 IEEE Biomedical Circuits and Systems Conference, 2019

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration.

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2017

Photoelectrochemical nitrate sensor utilizing Cu/Pd nanoparticles on TiO2-nanoparticles carrier: Combination of catalytic and photocatalytic mechanism.

Rita Siris, Jamila Boudaden, Armin Klumpp

Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017

2016

Smart capacitive CO2 sensor.

Jamila Boudaden, Armin Klumpp, Ignaz Eisele, Christoph Kutter

Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016

3D TSV based high frequency components for RF IC and RF MEMS applications.

Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2010

3D Integration technology: Status and application development.

Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc

Proceedings of the 36th European Solid-State Circuits Conference, 2010

3D-integration of silicon devices: A key technology for sophisticated products.

Armin Klumpp, Peter Ramm, Robert Wieland

Proceedings of the Design, Automation and Test in Europe, 2010

High performance 3D interconnects based on electrochemical etch and liquid metal fill.

Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC.

Ladislav Andricek, Michael Beimforde, Armin Klumpp, Anna Macchiolo, Karl-Reinhard Merkel, Hans-Günther Moser, Richard Nisius, Rainer Helmut Richter, Josef Weber, Philipp Weigell, Robert Wieland

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2008

Technologies for 3D Heterogeneous Integration

Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl

CoRR, 2008