Anne Seppälä

According to our database, Anne Seppälä authored at least 3 papers between 2002 and 2004.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2004

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints.

Anne Seppälä, Eero Ristolainen

Microelectron. Reliab., 2004

Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates.

Laura Frisk, Anne Seppälä, Eero Ristolainen

Microelectron. Reliab., 2004

2002

Failure mechanisms of adhesive flip chip joints.

Anne Seppälä, T. Allinniemi, Eero Ristolainen

Microelectron. Reliab., 2002