Anne Jourdain

According to our database, Anne Jourdain authored at least 17 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Backside Power Delivery with relaxed overlay for backside patterning using extreme wafer thinning and Molybdenum-filled slit nano Through Silicon Vias.

P. Zhao, Liesbeth Witters, Anne Jourdain, Michele Stucchi, Nicolas Jourdan, J. W. Maes, H. Bana, C. Zhu, R. Chukka, F. Sebaai, Kevin Vandersmissen, N. Heylen, D. Montero, S. Wang, K. D'Have, F. Schleicher, J. De Vos, Gerald Beyer, A. Miller, Eric Beyne

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2023

Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node.

Giuliano Sisto, R. Preston, Rongmei Chen, Gioele Mirabelli, Anita Farokhnejad, Yun Zhou, Ivan Ciofi, Anne Jourdain, A. Veloso, Michele Stucchi, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Nano-Through Silicon Vias (nTSV) for Backside Power Delivery Networks (BSPDN).

Eric Beyne, Anne Jourdain, Gerald Beyer

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2022

Scaled FinFETs Connected by Using Both Wafer Sides for Routing via Buried Power Rails.

Anabela Veloso, Anne Jourdain, D. Radisic, Rongmei Chen, G. Arutchelvan, B. O'Sullivan, Hiroaki Arimura, Michele Stucchi, An De Keersgieter, M. Hosseini, T. Hopf, K. D'Have, S. Wang, E. Dupuy, G. Mannaert, Kevin Vandersmissen, S. Iacovo, P. Marien, S. Choudhury, F. Schleicher, F. Sebaai, Yusuke Oniki, X. Zhou, A. Gupta, Tom Schram, B. Briggs, C. Lorant, E. Rosseel, Andriy Hikavyy, Roger Loo, J. Geypen, D. Batuk, G. T. Martinez, J. P. Soulie, Katia Devriendt, B. T. Chan, S. Demuynck, Gaspard Hiblot, Geert Van der Plas, Julien Ryckaert, Gerald Beyer, E. Dentoni Litta, Eric Beyne, Naoto Horiguchi

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections.

A. Vandooren, N. Parihar, Jacopo Franco, Roger Loo, Hiroaki Arimura, R. Rodriguez, F. Sebaai, S. Iacovo, Kevin Vandersmissen, W. Li, G. Mannaert, D. Radisic, E. Rosseel, Andriy Hikavyy, Anne Jourdain, O. Mourey, G. Gaudin, Shay Reboh, L. Le Van-Jodin, Guillaume Besnard, C. Roda Neve, Bich-Yen Nguyen, Iuliana P. Radu, E. Dentoni Litta, N. Horiguchi

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Enabling Active Backside Technology for ESD and LU Reliability in DTCO/STCO.

Kateryna Serbulova, S.-H. Chen, Geert Hellings, Anabela Veloso, Anne Jourdain, Dimitri Linten, Jo De Boeck, Guido Groeseneken, Julien Ryckaert, Geert Van der Plas, Eric Beyne, Eugenio Dentoni Litta, Naoto Horiguchi

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Backside PDN and 2.5D MIMCAP to Double Boost 2D and 3D ICs IR-Drop beyond 2nm Node.

Rongmei Chen, Giuliano Sisto, Michele Stucchi, Anne Jourdain, Kenichi Miyaguchi, Pieter Schuddinck, P. Woeltgens, H. Lin, Naveen Kakarla, Anabela Veloso, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Geert Van der Plas, Julien Ryckaert, Eric Beyne

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling.

Anabela Veloso, Geert Eneman, An De Keersgieter, P. Favia, Andriy Hikavyy, Rongmei Chen, Anne Jourdain, N. Horiguchi

Proceedings of the International Conference on IC Design and Technology, 2022

2016

Extreme wafer thinning optimization for via-last applications.

Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Die to wafer 3D stacking for below 10um pitch microbumps.

Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2012

MEMS packaging and reliability: An undividable couple.

Harrie A. C. Tilmans, Jeroen De Coster, Philippe Hélin, Vladimir Cherman, Anne Jourdain, Piet De Moor, Bart Vandevelde, Nga P. Pham, Joseph Zekry, Ann Witvrouw, Ingrid De Wolf

Microelectron. Reliab., 2012

2011

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

3D stacking using Cu-Cu direct bonding.

Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications.

Anne Jourdain, Thibault Buisson, Alain Phommahaxay, Mark Privett, Dan Wallace, Sumant Sood, Peter Bisson, Eric Beyne, Youssef Travaly, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).

Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on 3D System Integration, 2009

TSV metrology and inspection challenges.

Ramakanth Alapati, Youssef Travaly, Jan Van Olmen, Ricardo Cotrin Teixeira, Jan Vaes, Marc van Cauwenbergh, Anne Jourdain, Greet Verbinnen, Gino Marcuccilli, Glenn Florence, Shay Wolfling, Christine Pelissier, Haiping Zhang, Jaydeep Sinha, Andreas Machura, Irfan Malik

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2004

Creep as a reliability problem in MEMS.

Robert Modlinski, Ann Witvrouw, Petar Ratchev, Anne Jourdain, Veerle Simons, H. A. C. Tilmans, Jaap M. J. den Toonder, Robert Puers, Ingrid De Wolf

Microelectron. Reliab., 2004