Anmin Hu

According to our database, Anmin Hu authored at least 10 papers between 1998 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

A Cross-City Federated Transfer Learning Framework: A Case Study on Urban Region Profiling.

Gaode Chen, Yijun Su, Xinghua Zhang, Anmin Hu, Guochun Chen, Siyuan Feng, Ji Xiang, Junbo Zhang, Yu Zheng

CoRR, 2022

2019

Adaptive Indoor Localization with Wi-Fi Based on Transfer Learning.

Anmin Hu, Lijun Zhang

Proceedings of the IEEE International Conference on Consumer Electronics - Taiwan, 2019

2014

Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates.

Jiaxing Liang, Tingbi Luo, Anmin Hu, Ming Li

Microelectron. Reliab., 2014

2013

Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps.

Qinghua Zhao, Anmin Hu, Ming Li, Jiangyan Sun

Microelectron. Reliab., 2013

Study on low-Ag content Sn-Ag-Zn/Cu solder joints.

Tingbi Luo, Zhuo Chen, Anmin Hu, Ming Li, Peng Li

Microelectron. Reliab., 2013

2012

Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation.

Wenjing Zhang, Wei Luo, Anmin Hu, Ming Li

Microelectron. Reliab., 2012

Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder.

Tingbi Luo, Anmin Hu, Jing Hu, Ming Li, Dali Mao

Microelectron. Reliab., 2012

2011

Effect of Ag on oxidation of Cu-base leadframe.

Wenyan Gen, Xi Chen, Anmin Hu, Ming Li

Microelectron. Reliab., 2011

Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates.

Jinglin Bi, Anmin Hu, Jing Hu, Tingbi Luo, Ming Li, Dali Mao

Microelectron. Reliab., 2011

1998

Effect of Sway on Image Fidelity in Whole-body Digitizing.

Brian D. Corner, Anmin Hu

Proceedings of the Conference on Three-Dimensional Image Capture and Applications, 1998