Andy Miller

According to our database, Andy Miller authored at least 15 papers between 1999 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects.

Pengfei Xu, Chiara Marchese, Guy Lepage, Negin Golshani, Ruben Van Eenaeme, Andrea Mingardi, Joost Van Ongeval, Rafal Magdziak, Luc Halipre, Darko Trivkovic, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Filippo Ferraro, Yoojin Ban, Joris Van Campenhout

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.

Pengfei Xu, Junwen He, Koen Kennes, Anton Dvoretskii, Arnita Podpod, Guy Lepage, Negin Golshani, Rafal Magdziak, Swetanshu Bipul, Dieter Bode, Peter Verheyen, Maumita Chakrabarti, Dimitrios Velenis, Andy Miller, Yoojin Ban, Filippo Ferraro, Joris Van Campenhout

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

2019

Process Complexity and Cost Considerations of Multi-Layer Die Stacks.

Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.

Bradley Snyder, Nivesh Mangal, Guy Lepage, Sadhishkumar Balakrishnan, Xiao Sun, Nicolas Pantano, Michal Rakowski, Lieve Bogaerts, Peter De Heyn, Peter Verheyen, Andy Miller, Marianna Pantouvaki, Philippe Absil, Joris Van Campenhout

Proceedings of the Optical Fiber Communications Conference and Exposition, 2018

Silicon Photonics for 56G NRZ Optical Interconnects.

Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil

Proceedings of the Optical Fiber Communications Conference and Exposition, 2018

2016

Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.

Joeri De Vos, Lan Peng, Alain Phommahaxay, Joost Van Ongeval, Andy Miller, Eric Beyne, Florian Kurz, Thomas Wagenleiter, Markus Wimplinger, Thomas Uhrmann

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Extreme wafer thinning optimization for via-last applications.

Anne Jourdain, Joeri De Vos, Fumihiro Inoue, Kenneth J. Rebibis, Andy Miller, Gerald Beyer, Eric Beyne, Edward Walsby, Jash Patel, Oliver Ansell, Janet Hopkins, Huma Ashraf, Dave Thomas

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Die to wafer 3D stacking for below 10um pitch microbumps.

Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Processing active devices on Si interposer and impact on cost.

Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.

Soon-Wook Kim, Lan Peng, Andy Miller, Gerald Beyer, Eric Beyne, Chung-Sun Lee

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Trees of integral triangles with given rectangular defect.

Andy Miller

Discret. Math., 2013

2011

Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.

Alain Phommahaxay, Anne Jourdain, Greet Verbinnen, Tobias Woitke, Peter Bisson, Markus Gabriel, Walter Spiess, Alice Guerrero, Jeremy McCutcheon, Rama Puligadda, Pieter Bex, Axel Van den Eede, Bart Swinnen, Gerald Beyer, Andy Miller, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-line metrology and inspection for process control during 3D stacking of IC's.

Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Counting numerical sets with no small atoms.

Jeremy Louis Marzuola, Andy Miller

J. Comb. Theory A, 2010

1999

Generating Functions for Actions on Handlebodies with Genus Zero Quotient.

Matt Compton, Andy Miller

J. Comb. Theory A, 1999