Andy Heinig

According to our database, Andy Heinig authored at least 15 papers between 2006 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2020

13-Gb/s Transmitter for Bunch of Wires Chip-to-Chip Interface Standard.

Muhammad Waqas Chaudhary, Andy Heinig, Bhaskar Choubey

Proceedings of the 63rd IEEE International Midwest Symposium on Circuits and Systems, 2020

Interconnect Aware Power Optimization of Low Swing Driver for Multi-Chip Interfaces.

Muhammad Waqas Chaudhary, Andy Heinig, Bhaskar Choubey

Proceedings of the 27th IEEE International Conference on Electronics, Circuits and Systems, 2020

2019

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration.

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Co-design of CML IO and Interposer channel for low area and power signaling.

Muhammad Waqas Chaudhary, Andy Heinig

Proceedings of the 2016 IEEE 19th International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2016

Interposer based integration to achieve high speed interfaces for ADC application.

Muhammad Waqas Chaudhary, Andy Heinig, Michael Dittrich

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Enabling automatic system design optimization through Assembly Design Kits.

Andy Heinig, Robert Fischbach

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Current and future 3D activities at Fraunhofer.

Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Effizienter Design Rule Check von 3D Systemaufbauten mit einer hierarchischen XML-basierten Modellierungssprache.

Robert Fischbach, Michael Dittrich, Andy Heinig

Proceedings of the Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen, 2014

System integration - The bridge between More than Moore and More Moore.

Andy Heinig, Manfred Dietrich, Andreas Herkersdorf, Felix Miller, Thomas Wild, Kai Hahn, Armin Grünewald, Rainer Brück, Steffen Krohnert, Jochen Reisinger

Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2014

Design rule check and layout versus schematic for 3D integration and advanced packaging.

Robert Fischbach, Andy Heinig, Peter Schneider

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

XML-Based Hierarchical Description of 3D Systems and SIP.

Susann Wolf, Andy Heinig, Uwe Knöchel

IEEE Des. Test, 2013

Layout dependent synthesis for manufacturing costs optimized 3D integrated systems.

Andy Heinig

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Multi-step approach for thermal optimization of 3D-IC and package.

Andy Heinig, Christoph Sohrmann

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Integration of multi physics modeling of 3D stacks into modern 3D data structures.

Peter Schneider, Andy Heinig, Robert Fischbach, Jens Lienig, Sven Reitz, Jörn Stolle, Andreas Wilde

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2006

Zeitbeschränkte Clusterung zur Design-Space-Exploration geclusterter VLIW-Prozessoren.

Andy Heinig, Mario Schölzel

Proceedings of the Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV), 2006